Test Prexa™Series

Prexa™, the next-generation 300mm wafer prober full of advanced functions, was developed with a new platform.

In addition to process scaling, 3D stacking is drawing the industry’s attention as it enables leading-edge packaging that integrates multiple devices and/or heterogeneous devices. Its implementation necessitates a wafer testing process with reliable KGD* performance, which requires advanced features for wafer probers.

While inheriting a number of key technologies from the Precio™ series, the Prexa™ wafer prober also adopts innovative functions and features—including error/assist reduction and enhanced automation—to achieve higher productivity than its predecessors.

Features

• Automation of operations including setups


• Error/assist reduction and high-accuracy contact enabled by the latest optic system and new algorithms


• High-speed inspection of probe tips and probe marks


• Software structure designed to enhance customer support

KGD: Known Good Die. It refers to bare chips (or bare dies) that have been fully tested and assured to be defect-free before being placed into their packages.

Prexa™ MS is a 300mm fully automated wafer prober that has the advanced features of Prexa™ as well as essential capabilities to perform wafer testing for memory devices. Memory devices today—most notably advanced DRAMs—tend to have increasing numbers of test pins and heat generation in device testing.

Prexa™ MS features exceptional load-bearing capacity of up to 1,000 kg (optional), achieving accurate contact with excellent load control. In addition, the system’s endothermic feature controls the heat dissipation corresponding to high heat generating device, enabling full-wafer contact testing of future memory devices.